Used Siemens SIPLACE D2 dual-gantry SMT mounter with C&P12/C&P6 head options, up to 31,000 CPH benchmark and flexible production setup.
When an SMT line needs more placement capacity but the product mix still includes both standard SMDs and medium-sized IC packages, a used Siemens SIPLACE D2 can be a practical expansion option. We can provide D2 machines with different C&P12 and C&P6 head combinations, conveyor setups and feeder packages, allowing buyers to select the available machine around the actual PCB and BOM rather than adding capacity that the production program cannot fully use.
The D2 uses two placement gantries, giving the machine more output than a single-gantry flexible mounter while retaining a choice of C&P head configurations. With two C&P12 heads, the original specification lists 27,200 CPH under IPC 9850 conditions and 31,000 CPH under the SIPLACE benchmark, with 40,500 CPH as the theoretical maximum. A mixed C&P12 and C&P6 setup gives up some headline speed but extends practical coverage for PCB programs containing a larger share of medium-sized IC packages.
For factories running several products, the D2 also provides useful material capacity. Up to 90 feeder tracks are available with compatible 3 × 8 mm S feeder modules, and the two removable component tables can be prepared outside active production to reduce interruption during product changeover. Single- and flexible dual-conveyor configurations were available, with PCB formats up to approximately 610 × 508 mm when the required options are installed. For plants already using SIPLACE D Series equipment, the D2 can add dual-gantry capacity while retaining a familiar feeder and programming environment.
The D2 is best suited to factories that need more output from standard SMD and IC placement and can keep both gantries productively loaded. It is less suitable when a large part of the BOM consists of tall connectors, heavy devices or irregular components that fall outside the C&P head range. Published CPH and accuracy figures are OEM reference values rather than guaranteed performance for an individual used machine. Actual output depends on head condition, calibration, feeder pickup, PCB program and overall machine condition, so the selected unit should be checked under powered-on production conditions where possible.

| Parameter | Reference Specification |
|---|---|
| Machine Type | Dual-gantry SMT placement machine |
| Gantries | 2 |
| Placement Head Options | C&P12 and C&P6 Collect & Place heads |
| Maximum IPC Rate | 27,200 CPH with 2 × C&P12 |
| Maximum SIPLACE Benchmark | 31,000 CPH with 2 × C&P12 |
| Theoretical Maximum | 40,500 CPH with 2 × C&P12 |
| C&P12 Component Range | Up to approximately 18.7 × 18.7 mm, depending on the installed camera and option package |
| C&P6 Component Range | Approximately 0201 to 27 × 27 mm |
| C&P12 Reference Accuracy | Approximately ±50 µm at 3σ |
| C&P6 Reference Accuracy | Approximately ±52.5 µm at 3σ |
| Feeder Capacity | Up to 90 tracks with compatible 3 × 8 mm S feeder modules |
| Component Changeover Tables | 2 removable tables |
| Maximum PCB Format | Up to approximately 610 × 508 mm with the required conveyor options |
| Conveyor Options | Single conveyor or flexible dual conveyor |
The highest placement rate and the widest component coverage come from different head combinations. Head type, camera package, conveyor and feeder equipment should therefore be confirmed on the actual used machine before the final configuration is selected.
For an existing D Series line, the choice between a D2 and a SIPLACE D1i depends on whether the factory needs more placement output or broader component flexibility. The two machines solve different production problems.
| Buying Requirement | SIPLACE D2 | SIPLACE D1i |
|---|---|---|
| Primary Production Goal | Add dual-gantry placement capacity for standard SMDs and compatible IC packages | Add flexible single-gantry capacity for a wider mix of standard, fine-pitch, tray-fed and special components |
| Placement Structure | Two C&P gantries | One gantry with one or two heads, depending on configuration |
| Maximum SIPLACE Benchmark | Up to 31,000 CPH with 2 × C&P12 | Up to 15,000 CPH with C&P12 |
| Component Focus | Standard SMDs and medium-sized IC packages within the C&P head range | Broader mixed-component production when Pick & Place capability is required |
| When We Would Choose It | When placement capacity is the bottleneck and both gantries can carry meaningful work on the PCB | When component variety creates more difficulty than placement speed |
| When It Is Less Suitable | When many large, tall or special components fall outside the available C&P range | When the main requirement is simply to increase standard-component throughput |
If the existing line already has enough flexible-placement capability and the next investment needs to raise SMD and IC output, the D2 is normally the more direct capacity-expansion choice. If difficult component types are still forcing work onto another machine or manual process, adding another high-output C&P machine may not solve the real production bottleneck.
For an available used D2, we can confirm the installed head combination, conveyor, camera package, feeder equipment and current machine condition. Current photos, available inspection records, powered-on operation and remote verification can also be reviewed before the final machine configuration is confirmed.
If you are not sure whether this product matches your machine, send us the model, label photo or old part picture for checking.