Used ASM SIPLACE D1i flexible pick-and-place machine with modular heads, 01005 option support and high-mix SMT production capability.
When one placement machine needs to handle standard SMDs, IC packages and more demanding components without adding several specialized machines to the line, a used SIPLACE D1i can provide a practical flexible-placement solution. We can provide multiple D1i machines with different placement-head combinations, conveyor setups and feeder packages, allowing buyers to select the available unit around the actual PCB, BOM and production requirement.
The D1i uses a single gantry that can be configured with one or two placement heads. A C&P12 head focuses on standard SMD placement and is rated at 13,000 CPH under IPC conditions and 15,000 CPH under the SIPLACE benchmark. A C&P6 head extends the practical component range to packages up to approximately 27 × 27 mm, while the Pick & Place head is intended for fine-pitch, tray-fed, larger and special components. This head flexibility allows the machine to cover a wider part of a mixed BOM instead of forcing difficult components onto another placement stage.
The platform also supports up to 90 feeder tracks with compatible S feeder modules, together with tape, tray, stick and other feeding methods for more complex component mixes. Single- and flexible dual-conveyor versions were available, and PCB formats can reach approximately 610 × 508 mm when the required long-board and wide-board options are installed. For factories already using SIPLACE D Series equipment, a D1i can be considered for replacement or additional flexible capacity while retaining a familiar feeder and programming environment.
The D1i is best suited to high-mix production, industrial electronics and other PCB programs where component variety matters more than maximum chip-placement speed. It is less suitable when production consists mainly of small standard SMDs and the main objective is to increase placement throughput; in that case, a dual-gantry machine such as the SIPLACE D2i may provide more useful placement capacity. Published speed and accuracy figures are OEM reference values. Actual performance on a used D1i depends on head condition, calibration, camera condition, feeder pickup, PCB program and overall machine condition.
| Parameter | Reference Specification |
|---|---|
| Machine Type | Flexible single-gantry SMT placement machine |
| Gantry | 1 |
| Placement Heads | One or two heads, depending on configuration |
| Head Options | C&P12, C&P6 and SIPLACE Pick & Place |
| C&P12 IPC Rate | 13,000 CPH |
| C&P12 SIPLACE Benchmark | 15,000 CPH |
| C&P12 Theoretical Maximum | 20,000 CPH |
| C&P6 SIPLACE Benchmark | 9,800 CPH |
| Pick & Place SIPLACE Benchmark | 2,800 CPH |
| C&P6 Component Range | Approximately 0201 to 27 × 27 mm, depending on vision and package conditions |
| Extended Component Range | Selected components up to approximately 200 × 125 mm with the appropriate Pick & Place setup and applicable restrictions |
| Optional 01005 Capability | Requires a compatible C&P12 head, high-resolution camera, dedicated 01005 package, suitable nozzles, feeders and software |
| Best Reference Placement Accuracy | Up to approximately ±30 µm at 3σ with the applicable head and vision configuration |
| Feeder Capacity | Up to 90 tracks with compatible 3 × 8 mm S feeder modules |
| Maximum PCB Format | Up to approximately 610 × 508 mm with the required long-board and wide-board options |
| PCB Thickness | Approximately 0.3–4.5 mm as standard |
| Maximum PCB Weight | 3 kg |
| Conveyor Options | Single conveyor or flexible dual conveyor |
The specifications above describe the original D1i platform. Component range, PCB size and small-component capability depend on the heads, cameras, conveyor and option packages installed on the individual machine and should be confirmed before purchase.
The D1i can serve very different production needs depending on the placement heads fitted to the gantry. For a used-machine purchase, selecting the correct head combination is more important than choosing the unit with the highest published speed.
| Production Requirement | D1i Configuration to Consider |
|---|---|
| Standard SMD placement | A C&P12 configuration provides the highest documented D1i placement rate for compatible standard components. |
| More medium-sized IC packages | A C&P6 head extends component coverage to packages up to approximately 27 × 27 mm. |
| Standard SMDs plus large or special components | A dual-head setup combining a Collect & Place head with Pick & Place gives the machine both multi-component placement and flexible component handling. |
| Fine-pitch, tray-fed or complex components | The Pick & Place head and the appropriate camera and tray equipment should be included in the machine configuration. |
| Frequent product changes | Feeder tables and the required feeding equipment should match the BOM so the next setup can be prepared with less interruption to production. |
| 01005 production | The complete 01005 package should be verified on the actual unit; the D1i model designation by itself does not confirm this capability. |
A lower-priced D1i can become the more expensive project if the factory later needs different heads, cameras, feeders or tray equipment before the intended PCB can run. For high-mix production, a machine that already matches the required component range and feeding method usually provides a faster path to usable capacity.
For an available used D1i, we can confirm the installed heads, camera package, conveyor, software version, feeder equipment and current machine condition. Current photos, available inspection records, powered-on operation and remote verification can also be reviewed before the final machine configuration is confirmed.
If you are not sure whether this product matches your machine, send us the model, label photo or old part picture for checking.
