Used ASM SIPLACE D2i dual-gantry placement machine with flexible conveyor, modular C&P heads and up to 31,000 CPH benchmark output.
For factories that need to add SMT placement capacity without making frequent product changes harder to manage, a used SIPLACE D2i is a practical dual-gantry option. We can provide D2i machines with different C&P12 and C&P6 head combinations, conveyor setups and feeder packages, allowing buyers to select the available machine around the actual PCB, BOM and production requirement.
With two C&P12 heads, the original specification lists 27,200 CPH under IPC conditions and 31,000 CPH under the SIPLACE benchmark, with 40,500 CPH as the theoretical maximum. A C&P12 and C&P6 combination lowers the benchmark to 23,000 CPH but gives the machine more room for medium-sized IC packages, while two C&P6 heads shift the balance further toward component flexibility. This allows the D2i to add useful placement capacity without limiting production to one narrow component mix.
The platform is also well suited to factories that change products frequently. Two removable component tables provide up to 90 tracks with compatible 3 × 8 mm S feeder modules, and the next material setup can be prepared away from active production. Single- and flexible dual-conveyor configurations were available, with synchronous or asynchronous board handling when the PCB program can benefit from two-lane operation. For factories already using SIPLACE D Series equipment, this combination can make the D2i practical for capacity expansion or replacement without changing the complete feeder and programming environment.
The D2i is best suited to mixed production dominated by standard SMDs and medium-sized IC packages. It is less suitable when the PCB contains a large number of tall connectors, heavy devices or special components beyond the documented 27 × 27 mm range; those products normally require a more flexible placement stage. Published CPH values are OEM references rather than guaranteed output for an individual used machine. Actual performance depends on head condition, calibration, feeder pickup, PCB program, conveyor stability and overall machine condition, so the selected unit should be checked under powered-on production conditions where possible.
| Parameter | Reference Specification |
|---|---|
| Machine Type | Flexible dual-gantry SMT placement machine |
| Gantries | 2 |
| Placement Head Options | C&P12 and C&P6 Collect & Place heads |
| Maximum IPC Rate | 27,200 CPH with 2 × C&P12 |
| Maximum SIPLACE Benchmark | 31,000 CPH with 2 × C&P12 |
| Theoretical Maximum | 40,500 CPH with 2 × C&P12 |
| Head Configuration Options | 2 × C&P12, C&P12 + C&P6, or 2 × C&P6 |
| Documented Component Range | 01005 with the required option package to approximately 27 × 27 mm, depending on the installed head and camera |
| C&P12 Reference Accuracy | Approximately ±50 µm at 3σ |
| C&P6 Reference Accuracy | Approximately ±52.5 µm at 3σ |
| Placement Force | Approximately 2.4–5.0 N |
| Feeder Capacity | Up to 90 tracks with compatible 3 × 8 mm S feeder modules |
| Component Changeover Tables | 2 removable tables |
| Maximum PCB Format | Up to approximately 610 × 508 mm with the required single-conveyor long- and wide-board options |
| PCB Thickness | Approximately 0.3–4.5 mm as standard |
| Maximum PCB Weight | 3 kg |
| Conveyor Options | Single conveyor or flexible dual conveyor |
01005 placement and the maximum PCB format both require the corresponding equipment. Camera type, nozzles, feeders, software and long- or wide-board conveyor options should be confirmed on the actual used machine.
The D2i provides the most value when the factory needs to balance placement capacity with frequent product changes. Its head modularity, material setup and PCB transport options can be matched to different production requirements rather than forcing every job through the same fixed configuration.
| Production Requirement | How the D2i Fits |
|---|---|
| High count of standard SMDs | A dual-C&P12 configuration provides the highest documented placement output, with a 31,000 CPH SIPLACE benchmark. |
| Mixed SMD and IC production | A C&P12 and C&P6 combination gives up some headline speed but extends practical coverage for larger IC packages. |
| Frequent product changes | Removable component tables and external setup preparation allow the next material setup to be prepared while the current product is still running. |
| Short-cycle or two-lane production | The flexible dual conveyor can run synchronously or asynchronously when reducing PCB transfer time contributes to line output. |
| 01005 production | The machine must have the correct C&P12 head, high-resolution camera, dedicated 01005 package, compatible feeders, nozzles and supporting software. |
| Large, tall or heavy special components | The D2i is not designed as a large-component placement platform. A machine with a suitable flexible head, such as a correctly configured SIPLACE D3, may be more appropriate. |
The useful D2i configuration is therefore determined by the PCB program. A machine with more options is not automatically the better purchase if those options do not contribute to the factory's actual component mix, changeover pattern or line cycle.
For an available used D2i, we can confirm the installed head combination, conveyor, camera package, software version, feeder equipment and current machine condition. Current photos, powered-on operation, available inspection records and remote verification can also be used to check the selected machine before the final configuration is confirmed.
If you are not sure whether this product matches your machine, send us the model, label photo or old part picture for checking.
