SMT Product Detail

Siemens SIPLACE D3 Three-Gantry SMT Mounter

Used Siemens SIPLACE D3 three-gantry SMT mounter with C&P12, C&P6 and TwinHead options for mixed SMD, IC and large-component production.

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Siemens SIPLACE D3 Three-Gantry SMT Mounter
Product Overview

For factories that need to increase placement capacity without giving up flexibility for mixed-component production, a used Siemens SIPLACE D3 is a practical three-gantry option. We can provide D3 machines in different C&P12, C&P6 and TwinHead configurations, so buyers can select the available unit around the actual PCB and BOM instead of adapting production to an unsuitable head combination.

With three C&P12 heads, the D3 is rated at 37,600 CPH under IPC 9850 conditions and 40,400 CPH under the SIPLACE benchmark, with a theoretical maximum of 61,000 CPH. More importantly, the three gantries can be configured for different placement tasks. C&P heads handle standard SMDs and IC packages efficiently, while a TwinHead configuration extends the machine toward larger, fine-pitch or more demanding components. This allows the D3 to add usable placement capacity while keeping a broader part of the BOM on the same machine.

For high-mix EMS, industrial control, communications and other PCB production with a wide component range, this flexibility can reduce the need to divide work across several placement stages. The platform also supports up to 180 feeder tracks with the applicable feeder-table setup, giving factories enough material capacity for component-dense boards and frequent product changes. For plants already operating SIPLACE D Series equipment, the D3 can also be considered for capacity expansion or replacement while retaining a familiar production environment.

The D3 is best suited to factories that need both higher placement capacity and flexibility across different component types. It is less suitable when production is almost entirely made up of small standard components and the only objective is maximum chip-placement throughput. Published CPH figures are OEM reference values rather than guaranteed output for an individual used machine. Actual performance depends on head condition, calibration, feeder setup, PCB program and overall machine condition, so the selected unit should be evaluated with configuration records and a powered-on placement test where available.

Siemens SIPLACE D3 Three-Gantry SMT Mounter

Siemens SIPLACE D3 Specifications

Parameter Reference Specification
Machine Type Three-gantry SMT placement machine
Gantries 3
Placement Head Options C&P12, C&P6 and SIPLACE TwinHead
Maximum IPC 9850 Rate 37,600 CPH with 3 × C&P12
Maximum SIPLACE Benchmark 40,400 CPH with 3 × C&P12
Theoretical Maximum 61,000 CPH with 3 × C&P12
Documented Component Range Approximately 0201 to 200 × 125 mm, depending on the installed heads, cameras and tooling
Feeder Capacity Up to 180 tracks with compatible 3 × 8 mm S feeder modules
Component Changeover Tables Up to 4
Maximum PCB Format Up to approximately 610 × 508 mm with the required conveyor options
PCB Thickness Approximately 0.3–4.5 mm as standard
Maximum PCB Weight Approximately 3 kg
Conveyor Options Single conveyor or flexible dual conveyor

The largest component sizes require a suitable TwinHead setup, while the highest published speed applies to the three-C&P12 configuration. These limits should not be combined and treated as the capability of every used D3.

SIPLACE D3 Head Configuration for Mixed Production

Head Configuration SIPLACE Benchmark Production Fit
3 × C&P12 40,400 CPH High component counts dominated by standard SMDs and compatible IC packages
2 × C&P12 + C&P6 36,200 CPH High standard-component output with additional coverage for larger IC packages
2 × C&P12 + TwinHead 31,400 CPH Standard SMD production combined with connectors, fine-pitch or special components
C&P12 + C&P6 + TwinHead 25,300 CPH High-mix boards where three different placement functions all have meaningful work

A lower benchmark does not automatically make a D3 configuration less useful. If the installed heads allow more of the PCB to be completed on the same machine, the factory may avoid shifting component groups to another placement stage and achieve a better-balanced line.

For the selected used D3, the final decision should be based on the actual head labels, feeder package, conveyor configuration and machine condition. Current machine photos, available inspection records and powered-on test evidence should be reviewed before the delivery scope is finalized.

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