Used ASM SIPLACE CA4 for flip chip, die attach and hybrid SMD production. Match wafer systems, feeder tables and process modules to the qualified process before purchase.
Replacing an established CA production machine can cost far more than the replacement equipment itself if the factory also has to rebuild wafer handling, material supply, software workflow and a process that has already been qualified. For factories that still run products on the SIPLACE CA platform, a correctly configured used CA4 can be a practical way to restore or add capacity without turning one machine replacement into a complete process migration.
The CA4 platform provides up to four material positions that can be configured with SIPLACE Wafer Systems, feeder changeover tables, or a combination of both. That allows the same platform to support direct-wafer flip chip, die attach, conventional SMD placement or a hybrid process. This flexibility is useful, but it also creates the biggest purchasing risk: two machines carrying the CA4 name can have very different production value.
For an existing CA user, this is where the used-machine economics become more important than the headline price. A machine that closely matches the current wafer systems, feeder layout, placement heads, dipping process, conveyor and software can preserve more of the production environment the factory has already paid to develop and qualify. The financial advantage is therefore not only lower capital commitment; it is also avoiding unnecessary changes around a process that is already working.
Our available used CA4 machines may differ in wafer systems, feeder tables, heads, conveyors, software and process modules. The CA4 is strongest as a replacement or expansion choice when the required process is already clear and a suitable configuration can be matched. It is less attractive when the factory is starting a completely new advanced-packaging process and would benefit more from a newer integrated platform.
| Parameter | Reference Specification |
|---|---|
| Machine Type | Hybrid flip-chip, die-attach and SMD placement platform |
| Material Positions | Up to 4 combined SIPLACE Wafer System and feeder changeover-table positions |
| Flip-Chip Benchmark | Up to approximately 46,000 CPH with 4 SIPLACE Wafer Systems |
| Die-Attach Benchmark | Up to approximately 30,000 CPH with 4 SIPLACE Wafer Systems |
| SMD Benchmark | Up to approximately 126,500 CPH with 4 feeder changeover tables |
| Flip-Chip Reference Accuracy | Approximately ±10 µm at 3σ with wafer-lane conveyor; approximately ±12 µm at 3σ with panel-lane conveyor |
| SMD Reference Accuracy | Approximately ±15 µm at 3σ |
| Supported Wafer Size | Approximately 4 to 12 inches, depending on installed wafer equipment |
| Flip-Chip Die Size | Approximately 0.5 to 15 mm |
| Die-Attach Die Size | Approximately 0.8 to 15 mm in the published configuration |
| Minimum Silicon Die Thickness | Approximately 50 µm |
| Minimum Bump Size | Approximately 25 µm for applicable flip-chip processes |
| Minimum Bump Pitch | Approximately 50 µm |
| Dipping System | Linear Dipping Unit available according to machine configuration |
These throughput values describe different OEM benchmark configurations. A CA4 equipped with four wafer systems is not the same production setup as one fitted with four feeder changeover tables, so the maximum flip-chip, die-attach and SMD rates should never be treated as simultaneous machine performance.
One of the most expensive mistakes in buying a used CA4 is choosing the correct model with the wrong material configuration. Before comparing prices, first confirm what production system the four available positions actually create.
| Typical Configuration | Main Production Role | Buying Logic |
|---|---|---|
| 4 Wafer Systems / 0 Feeder Tables | Direct-wafer flip-chip or die-attach production | Best when bare-die processing is the main requirement and the existing process already uses wafer-fed production |
| 2 Wafer Systems / 2 Feeder Tables | Hybrid bare-die and conventional SMD placement | Best when the qualified product genuinely combines wafer-fed dies and feeder-supplied components |
| 0 Wafer Systems / 4 Feeder Tables | Feeder-based SMD placement | Best when the CA platform is mainly being used for conventional component placement |
For a replacement project, we would normally start with the current process rather than the largest benchmark number. Matching the wafer systems, feeder tables, heads, dipping equipment, conveyor and software can reduce the amount of requalification and line modification required after installation. A cheaper CA4 with important modules missing can easily become the more expensive project.
The strongest case for a used CA4 is therefore continuity: restore or expand a production process the factory already understands without automatically committing to a complete new-platform migration. For factories that also want maintenance backup, compatible ASM SIPLACE feeders, heads, nozzles and replacement parts can be matched through our ASM spare-parts supply by machine model, part number and installed position where suitable items are available.
Before the final machine is selected, the actual wafer systems, feeder tables, heads, process modules, software and conveyor should be checked from current machine information. For factories evaluating a broader CA platform change rather than a like-for-like replacement, the SIPLACE CA2 should be compared on process architecture rather than CPH alone.
If you are not sure whether this product matches your machine, send us the model, label photo or old part picture for checking.
