ASM SIPLACE CA4 four-gantry hybrid flip-chip and SMT machine for assembly processes involving bare semiconductor dies and surface-mount components.
Bare-die placement and conventional SMT assembly involve different component handling methods. The ASM SIPLACE CA4 combines these processes on a four-gantry platform, bringing hybrid flip-chip and surface-mount placement into one machine configuration. This makes the CA4 distinct from a conventional SMT mounter that handles only packaged components supplied through standard feeders.
The key technical consideration is the relationship between wafer handling, die pickup and placement accuracy. The installed tooling and process options determine which bare-die and SMT operations a specific CA4 can perform, so the machine's actual configuration must be verified before matching it to a production process.
Technical Item | Specification |
|---|---|
Machine Platform | Four-gantry hybrid placement platform |
Assembly Processes | Flip Chip, Die Attach and SMD Placement |
Wafer Handling | SIPLACE Wafer System; configuration dependent |
Supported Wafer Sizes | 4–12 inches, depending on installed wafer system |
Flip Chip Die Size | 0.5–15.0 mm |
Die Attach Size | 0.8–15.0 mm |
SMD Component Size | 0.11–15.0 mm |
Minimum Silicon Die Thickness | 50 µm |
Minimum Bump Size | 25 µm |
Minimum Bump Pitch | 50 µm |
Flip Chip Placement Accuracy | Up to ±10 µm at 3σ, depending on conveyor configuration |
Die Attach Placement Accuracy | Up to ±10 µm at 3σ, depending on conveyor configuration |
SMD Placement Accuracy | ±15 µm at 3σ under the specified configuration |
If you are not sure whether this product matches your machine, send us the model, label photo or old part picture for checking.
