SiP production with SMT and die attach: Used ASM SIPLACE CA 2 hybrid platform. CP20 head, 76,000 cph SMT, 51,000 cph flip-chip, 10μm @3σ. 50-wafer, 13-second swap. What's your die and SMD mix? We'll tailor the right process config.
Unlike a conventional SMT mounter focused on placing packaged components onto PCBs, the ASM SIPLACE CA2 belongs to the hybrid assembly equipment category, where component placement and die attach requirements call for closer attention to the installed process configuration. Its suitability depends on the type of components being handled, the required bonding or attachment process, and the production flow in which the machine will operate.
For buyers evaluating a used CA2, the key checks are the installed tooling and process options, supported workpiece and component formats, machine condition, and availability of technical support for the intended application. Confirming these details before purchase helps establish whether the equipment fits an existing hybrid assembly line or a specialized production process.
We offer used ASM SIPLACE CA2 equipment for manufacturers evaluating hybrid SMT and die attach capabilities.
If you are not sure whether this product matches your machine, send us the model, label photo or old part picture for checking.
