SMT Product Detail

ASM SIPLACE X3 S High-Speed SMT Placement Machine

Explore used ASM SIPLACE X3 S SMT placement equipment for electronics manufacturing. We supply used placement machines for SMT production-line upgrades and replacement needs.

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ASM SIPLACE X3 S High-Speed SMT Placement Machine
Product Overview

High-mix SMT production requires a balance between placement speed, component flexibility, and efficient use of production-floor space. The ASM SIPLACE X3 S belongs to the SIPLACE placement platform, where machine configuration and placement-head capabilities influence how a line handles different PCB assembly requirements. For buyers evaluating used SMT equipment, the relevant question is not speed alone, but whether the machine configuration matches the component range, board mix, and throughput targets of the intended production line.

The X3 S is part of ASM's high-speed placement equipment family. Its value in a used-equipment assessment depends on the installed placement heads, feeder arrangement, supported component range, software configuration, and machine condition. These details should be checked against the actual unit rather than assumed from the model name, particularly when planning integration into an existing SMT line.

We supply used SMT placement machines and semiconductor manufacturing equipment. For the ASM SIPLACE X3 S, we can provide available machine details to help buyers assess its configuration and suitability for their production requirements.

ASM SIPLACE X3 S Three-Gantry SMT Placement Machine

ASM SIPLACE X3 S Specifications

Machine TypeThree-gantry SMT placement machine
Placement ArchitectureTwo placement areas: one with two head positions and one with a single head position
Placement HeadsCP20 / SpeedStar, CPP / MultiStar and TWIN / TwinStar, depending on generation and configuration
Current Benchmark PerformanceUp to 112,500 CPH with three corresponding high-speed heads
Current IPC PerformanceUp to 97,050 CPH
CPP Low Assembly PositionUp to approximately 27 × 27 mm and 6 mm component height
CPP High Assembly PositionUp to approximately 50 × 40 mm and 11.5 mm with the applicable stationary camera configuration
Feeder CapacityUp to 160 × 8 mm feeder positions
PCB SizeApproximately 50 × 50 mm to 850 × 685 mm, depending on conveyor and option configuration
ConveyorSingle conveyor or flexible dual conveyor

What the Third Head Actually Does

Third HeadWhat It AddsWhat Must Be True
CP20P2Additional high-speed small-component placementThird gantry needs enough small-component placements to stay loaded
CPP_LFlexible placement within the low-position CPP component envelopeRequired components must stay within the low-position size and height limits
CPP_HBroader coverage for larger or taller componentsHigh assembly position and stationary camera must both be present
TWINLarge or special-component placementThe BOM must contain enough suitable special-component work for the third gantry


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