ASM SIPLACE X2 S SMT placement machine with two-head configuration options for balancing chip-placement speed and component coverage.
A PCB assembly line rarely consists entirely of tiny chip components. IC packages, fine-pitch devices and larger parts can interrupt a high-speed placement sequence when they require a different head or handling method. The ASM SIPLACE X2 S allows two placement heads to be configured on the same machine, so the choice of head combination can reflect the actual component list rather than forcing every placement task through one head type.
For a used X2 S, the installed head combination is more informative than the model name alone. Two high-speed heads prioritize output on chip-heavy boards, while a mixed configuration can extend component coverage at the expense of peak placement rate. Feeder capacity and vision options further affect how the machine fits into an existing production line.
| Machine Type | Dual-gantry SMT placement machine |
|---|---|
| Placement Gantries | 2 |
| Placement Heads | CP20 / SpeedStar, CPP / MultiStar and TWIN / TwinStar, depending on generation and configuration |
| Current Benchmark Performance | Up to 75,000 CPH with the corresponding dual high-speed-head configuration |
| Current IPC Performance | Up to 65,000 CPH |
| High-Speed Head Component Range | Approximately 0201 metric to 8.2 × 8.2 × 4 mm in current high-speed-head documentation |
| Extended Component Range | Larger and special components require the appropriate CPP or TWIN configuration; maximum range depends on the installed head |
| Feeder Capacity | Up to 160 × 8 mm feeder positions |
| PCB Size | Approximately 50 × 50 mm to 850 × 685 mm, depending on conveyor and option configuration |
| Conveyor | Single conveyor or flexible dual conveyor |
If you are not sure whether this product matches your machine, send us the model, label photo or old part picture for checking.
